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This specialized low-viscosity tin-catalyzed silicone is formulated exclusively for the encapsulation and potting of sensitive electronic modules. Unlike molding rubbers designed for mechanical replication, this compound prioritizes electrical insulation, stress relief, and penetration into microscopic voids, ensuring the long-term reliability of circuit assemblies exposed to harsh environments.
The uncured mixture possesses an exceptionally low viscosity, allowing it to flow effortlessly under SMD components, around connectors, and through densely packed PCB architectures. It self-levels and self-deaerates to a significant degree, reducing the risk of trapped air bubbles that could compromise dielectric performance. Working time is approximately 20 minutes at 25°C, and initial cure handling strength develops within 4 hours, enabling high-throughput production lines to move assemblies quickly. Full electrical and mechanical properties stabilize after an ambient 24-hour cure cycle.
Electrically, the cured elastomer offers outstanding insulation characteristics: high dielectric strength, volume resistivity, and a low dielectric constant that remains stable across a wide frequency range. These properties make it suitable for protecting LED power supplies, sensor modules, automotive ignition components, and IoT sensor nodes from moisture ingress, vibration fatigue, and thermal shock. The soft, gel-like consistency—typically Shore A 15—absorbs mechanical stress and prevents wire bonds from fracturing during thermal cycling.
A key advantage of this formulation is its neutral crosslinking mechanism, which releases alcohol vapor rather than acetic acid or other corrosive by-products. This ensures copper traces, solder joints, and sensitive electronic metals remain free from oxidation and corrosion throughout the product’s service life. The material maintains its flexibility over a broad temperature range from -50°C to 200°C, and it can be modified with thermally conductive fillers for applications that require heat dissipation. Supplied in bulk containers or dual cartridges for meter-mix dispensing, this potting compound helps electronics manufacturers meet stringent reliability standards while simplifying the production process.
| Model Code | Hardness (Shore A) | Viscosity (Cps) | Mixing Ratio | Tear Strength (kN/m²) | Tensile Strength (MPa) | Shrinkage | Elongation at Break |
|---|---|---|---|---|---|---|---|
| GTSIL-P0 | 0 | 1500-3000 | 1:1 | 10-15 | 3-5 | ≤0.1% | 400-500% |
| GTSIL-P5 | 4-6 | 2000-4000 | 1:1 | 12-16 | 3-5 | ≤0.1% | 500-600% |
| GTSIL-P10 | 8-10 | 3000-5000 | 1:1 | 14-17 | 3.5-5.5 | ≤0.1% | 500-600% |
| GTSIL-P15 | 14-16 | 4000-6000 | 1:1 | 16-18 | 4-6 | ≤0.1% | 500-600% |
| GTSIL-P20 | 19-21 | 4000-7000 | 1:1 | 18-22 | 4-6 | ≤0.1% | 500-600% |
| GTSIL-P25 | 24-26 | 5000-8000 | 1:1 | 22-26 | 4-6 | ≤0.1% | 400-500% |
| GTSIL-P30 | 28-30 | 6000-9000 | 1:1 | 20-23 | 4-6 | ≤0.1% | 400-500% |
| GTSIL-P35 | 34-36 | 6000-9000 | 1:1 | 16-19 | 4-6 | ≤0.1% | 350-500% |
| GTSIL-P40 | 38-42 | 4000-6000 | 1:1 | 12-16 | 3.5-5.5 | ≤0.1% | 300-450% |
| GTSIL-P45 | 43-46 | 3000-5000 | 1:1 | 10-15 | 3-5 | ≤0.1% | 300-450% |
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