Managing heat is the defining challenge in power electronics, EV battery systems, and high-brightness LED arrays. This two-part, heat-curable silicone rubber is loaded with proprietary thermally conductive fillers—such as aluminum oxide and boron nitride—to deliver a thermal conductivity of 1.5–3.0 W/m·K while retaining the flexibility and electrical insulation that make silicones essential in electronic design.
The uncured compound is a soft, paste-like putty with a balanced viscosity that can be dispensed through automated meter-mix equipment or applied manually. It conforms easily to irregular board profiles and fills voids between heat-generating components and heatsinks or housings, ensuring near-zero interfacial thermal resistance. Pot life ranges from 30 to 90 minutes depending on the selected catalyst ratio, offering both rapid prototyping and extended production window options. Full cure is achieved with a mild heat schedule, typically 10–30 minutes at 100–150°C, which suits inline curing ovens and batch processing alike.
After vulcanization, the silicone exhibits a Shore A hardness of 40–60, providing enough mechanical strength to support components while remaining compliant enough to absorb thermal cycling stresses. It delivers a dielectric strength of ≥18 kV/mm and volume resistivity of ≥1×10¹⁴ Ω·cm, guaranteeing reliable isolation even at high operating voltages. The cured material is non-corrosive, non-bleeding, and resistant to a broad spectrum of automotive fluids and industrial chemicals, making it suitable for underhood electronics, onboard chargers, and power inverters.
Unlike rigid epoxy encapsulants, this silicone does not crack under temperature swings from -40°C to 200°C, extending the service life of solder joints and wire bonds. It can be applied as a gap filler, encapsulant, or component staking compound, and is fully compatible with copper, aluminum, and FR-4 substrates. For designers pushing power density limits, this thermally conductive silicone reduces hot-spot temperatures, improves reliability, and helps meet ever-tightening thermal budgets.
